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Products for back-grinding process/DBG process

Thank you for visiting our web site. We have provided you the following check sheet for choosing the suitable Back-grinding tape. Please fill out the sheet as much as possible. If you have any questions or comments, please feel free to contact us at 1-480-966-0784.

A. Please fill out the information about your current wafer.

Material	Si GaAs Others
Size	4" 5" 6" 8" 12"
Thickness	Before Grind m     After Grind m Etching Yes No
Surface condition	Type of Layer PI Si-N Others Thickness of Layer m Area of Layer Circuit Surface only Over All Bump Yes No Type of Bump Bump Height m Bump Pitch m
Type	V-notch Orientation Flat
Device type

B. Please fill out the information about your current BG tape.

Company name
Model
Adhesion	Please indicate a unit.
Tape type	UV Curable Type Water Flushable Type
Width x Length	mm     M
Thickness Request	Yes m    No
Consumption/Month	m    Roll(s)
Please explain your problems or requests.

C. Please fill out the information about your current BG tape laminator. (Taper)

Type	Manual    Full-Automatic
Company name
Model

D. Please fill out the information about your current BG tape remover. (Detaper)

Type	Manual Full-Automatic
Company name
Model
UV Irradiation Unit	With     Without

Any comments:

Please fill out following questions. (Please fill out all items.)

Name
Company name
Section
Address
Phone #
FAX #
E-Mail

Thank you for your cooperation. Our sales representatives will contact with you later.