PRODUCTS


Products for back-grinding process/DBG process

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  • Thank you for visiting our web site. We have provided you the following check sheet for choosing the suitable Back-grinding tape. Please fill out the sheet as much as possible. If you have any questions or comments, please feel free to contact us at 1-480-966-0784.

    A. Please fill out the information about your current wafer.

    Material
    Si GaAs Others
    Size
    4" 5" 6" 8" 12"
    Thickness
    Before Grind m     After Grind m     Etching Yes no
    Surface condition
    Type of Layer PI Si-N Others
    Thickness of Layer m
    Area of Layer Circuit Surface only Over All     
    Bump Yes No
    Type of Bump     Bump Height m
    Bump Pitch m
    Type
    V-notch Orientation Flat
    Device type

    B. Please fill out the information about your current BG tape.

    Company name
    Model
    Adhesion
    Please indicate a unit.
    Tape type
    UV Curable Type Water Flushable Type
    Width x Length
    mm     M
    Thickness Request
    Yes m No
    Consumption/Month
    m     Roll(s)
    Please explain your problems or requests.

    C. Please fill out the information about your current BG tape laminator. (Taper)

    Type
    Manual Full-Automatic
    Company name
    Model

    D. Please fill out the information about your current BG tape remover. (Detaper)

    Type
    Manual Full-Automatic
    Company name
    Model
    UV Irradiation Unit
    With Without
     
         Any comments:

    Please fill out following questions. (Please fill out all items.)

    Name
    Company name
    Section
    Address
    Phone #
    FAX #
    E-Mail
    Thank you for your cooperation. Our sales representatives will contact with you later.
     
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