PRODUCTS

Products for back-grinding process/DBG process

The Adwill E-series is a selection of UV curable BG tape that protects a wafer surface during back grinding and prevents the surface from contamination by grinding chips. When peeling the tape, the adhesive strength is largely weakened due to UV irradiation. Therefore, you can peel the tape without stress applied to the wafer, allowing the tape to be used for large thin wafers.

Standard Type

High reliability of devices
The amount of particles adhered to the wafer surface is extremely small. Therefore, it is not necessary to wash the wafer after back grinding. And also, harmful ion substances cause no problems to devices.

Production lines with high clean-level
Adhesive tape production lines have achieved a class 100 environment (conforms to U.S. Federal Standard 209b).

Thin and High Bumped Wafer Type

Preventing wafer warping after back grinding and maintaining a smooth surface
We have developed base materials and adhesive to maintain a smooth wafer surface and prevent wafers from damage, generation of dimples due to bumps. These improved wafer thickness accuracy after back grinding. Thin wafers are also less prone to warping.

Improved wafer thickness accuracy (T.T,V.)
Accuracy of the tape thickness ensures the wafer thickness accurate after back grinding.

Reliably protects the wafer surface during back grinding to prevent the wafer surface from contamination caused by chips.
After peeling, a remained adhesive amount is extremely small.
If particles remain on the wafer surface after peeling the tape, you can wash them off with DI water.
The adhesive does not contain any water-soluble low molecular component, thus you have no worries to contaminate the cleaning water.
Accuracy of the tape thickness ensures the wafer thickness accurate after back grinding.

This is a special tape to peel off the BG tape with RAD-3000series tape remover for the back grinding.
You can peel the BG tape without damaging the wafer used with the RAD-3000series.
You can adhere firmly by thermocompression and reliably peel the BG tape from a wafer, regardless of the tape material. * LINTEC also have provided conventional adhesive tapes other than heat seal ones.

		Obtained ISO14001 certificate JQA-EM0505 Agatsuma				Obtained ISO9002 certificate JQA-1277 Agatsuma
Agatsuma (in Gunma Pref.), where E-series and P-series tapes are manufactured, is ISO14001 certified for the environment management system and ISO9002 certified for the quality management system.