BG Tape
Two types of back grinding tape are available. The "E series" which can be removed without placing stress on the wafer by decreasing adhesion by UV irradiation, and the "P series" which is non-UV type. In addition, there is the "S series" peeling tape.
Product Information
Back Grinding Process |
- Standard
- Micro Bump (including ink dot)
- Bump (height: <100μm
- High Bump (height: <250μm)
- Ultra Thin Grinding (thickness: >40μm)
|
Dicing Before Grinding Process |
- Bump (height: <100μm
- Ultra Thin Grinding (thickness: >40μm)
- Plasma Etching
|
The Adwill E series of UV curable back grinding tapes ensure against wafer surface damage during back grinding and prevent wafer surface contamination caused by infiltration of grinding fluid and/or debris. Adhesion of the tapes can be substantially decreased with UV irradiation, allowing easy removal without placing stress on the wafer. This feature makes the series suitable for the processing of large diameter, thin wafers.
Standard Type (General-purpose)
- High device reliability
Since contamination of the wafer surface is extremely minimal, the wafer does not require cleaning after back grinding.
- Maintains a high level of cleanness throughout the production system
The adhesive coating environment exceeds class 100 (US Federal Standard 209b).
Tape Types for Thin, Bump Wafers
- Tape for preventing wafer bow after back grinding, and for bump wafers
The inherent stress relaxation capability of this tape, curtails wafer bow that would otherwise arise after back grinding due to residual stress during tape lamination. Moreover, by dispersing stress during back grinding of bump wafers, this tape prevents wafer damage and wafer dimples, while enhancing wafer thickness accuracy.
- Improved wafer thickness accuracy (T.T.V.*)
High precision tape thickness accuracy ensures precision wafer thickness after back grinding.
*T.T.V.=Total Thickness Variation
Product Information
Back Grinding Process |
- Standard
- Micro Bump (including ink dot)
- Thin Grinding (thickness: >60μm)
|
- Fully protects the wafer surface during back grinding and prevents wafer surface contamination from infiltration of grinding fluid and/or debris.
- There is virtually no residual adhesive after tape is peeled off.
- For cases in which slight contamination remains because of wafer surface configuration, the lineup includes a type that can be removed by cleaning with pure water. Additionally, there is no danger of contamination from cleaning fluids because there are no water-soluble ingredients of light molecular weight in the adhesive.
- High precision tape thickness accuracy ensures precision wafer thickness after back grinding.
- A special-purpose tape for removing back grinding tape with the Wafer Mounter RAD-2500 series and the BG Tape Remover RAD-3000 series.
- This tape, used in combination with each equipment, allows the removal of back grinding tape without damaging the wafer.
- Regardless of the back grinding tape's material, the peeling tape is securely adhered by thermo-compression bonding, allowing the complete removal of the back grinding tape.
ISO 9001 : 2008
Certificate JP08/060975
Lintec Corporation
Agatsuma Plant
Technology Administration
R&D Div. Research Laboratory
Planning Dept.
Business Administration Div.
Advanced Materials Operations.
ISO 9001 : 2008
Certificate JQA-QM7787
Lintec Corporation
Ina Technology Center
ISO 14001 : 2004
Certificate JP08/070484
Lintec Corporation
(Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others)
At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.
