Products for back-grinding process/DBG process

Proprietary tape lamination method (Japanese Patent Application Publication No. 10-330022) Uses the TTC* system, with proven results in wafer mounting in the dicing process. Achieves tension-free lamination of the BG tape, and reduces stress on thin wafers after back grinding. Improved reliability in backgrinding process Applies a newly developed tape cutting technique (Japanese Patent Application Publication No. 10-329087) to achieve a fine cut on the BG tape. Contribution to higher productivity The double cassette table allows continuous wafer loading, reducing machine idle time and contributing to higher productivity. Sophisticated design and functionality Machine operation and operator safety fully comply with SEMI safety guidelines, which are observed right from the design and assembly stages. Taking a proactive approach to reducing environmental hazards, we provide a function that separates the tape base material from the release liner. Complies with SEMI S2-93A (Safety) and SEMI S-8 (Ergonomics) Supports CE marking Host communication function (Communications: compliant with SECSI and HSMS, software: compliant with GEM) Barcode reader Double loader Wafer box loader

*TTC (Tape Tension Control) System:
The TTC is a cutting-edge system, where a microcomputer controls tape tension. It enables the tape to be laminated according to the tape type and wafer specifications. On fully automatic machines, you can set and register tape application torque from a touch panel.

A. Wafer loading, scanning and unloading
The wafer scan sensor automatically detects the wafer storage condition. The robot arm with three-axis control transfers the wafer to the alignment unit.

B. Wafer alignment
The wafer is aligned with reference to the orientation flat or V-notch, and then the transfer arm sets the wafer on the tape application table.

C. BG tape application
The press roller laminates the BG tape to the wafer while the tape application table moves back and forth. The TTC system enables the BG tape to be laminated on the wafer without any stress.

D. Tape cutting
(sheet and wafer edge cutting)
The tape is cut while rotating the table with the cutter knife in a fixed position. Three-dimensional (X, Y, _) control of the cutter knife achieves smooth tape cutting even for the corners of the orientation flat, where more tape chips are generated.

E. Redundant tape disposal
Redundant tape after tape cutting is peeled from the table by the peeling arm, and then placed in the dust box.

F. Wafer storage
The robot arm unloads the wafer with BG tape applied in the cassette.

• A fully automatic BG tape laminator for 200mm wafers
• Using the TTC system enables tape lamination to match the wafer condition after backgrinding.
• The fine cutting technique used for BG tape prevents damage to wafers from backgrinding.

1. Applicable to large diameter, thin wafers
   The TTC system enables BG tape to be laminated on the wafer without any stress. It is possible to process large diameter, thin wafers.
2. Compact, high performance unit
   Suitable for small-lot production in the assembly process, and can also be used for research and development. The compact design of the machine helps space saving; yet it can handle 300mm wafers.
3. Easy-to-operate semi-automatic machine
   Once the wafer is set on the application table, the BG tape can be laminated automatically and cut in one simple input operation.
4. New tape cutting technique
   Cuts the BG tape by rotating the table while the cutter knife held in a fixed position. This means smoother tape cutting even for corners of the orientation flat, where more tape chips are generated, for improved product reliability in the backgrinding process.