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Products for back-grinding process/DBG process
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- Ideal tape peeling
The ideal 180 degrees peeling technique (Japanese Patent Application Laid-open No. 11-16862 (1999)) is
employed to peel the BG tape from the wafer. This technique minimizes the stress applied to the wafer
when peeling the tape from the wafer, allowing the machine to process even thin wafers.
- Elimination of damage to wafer circuit surface
The heat seal tape (that is used for peeling the BG tape) is thermally compressed to the tape at a point
less than 3 mm from the wafer periphery. This greatly reduces damage to the wafer circuit caused by heat
seal tape attachment and remaining adhesive.
- Excellent cost performance
The consumption of heat seal tape does not vary depending on the wafer size. Since the heat seal tape is
the thermal compressing type, reliable attachment is ensured regardless of the presence of silicon dust
remaining on the BG tape.
- Automatic control of UV illumination and light intensity
The built-in sensor provides feedback control so that the UV illumination and light intensity can be kept
constant. This means that the level of UV illumination can be kept constant throughout the lamp's service
life, ensuring stable tape peeling even when using UV curable BG tape.
- (Communication method: Conforms to SECS I and HSMS, Software: Conforms to GEM)
- Barcode reader
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A Wafer loading, scanning and unloading
The wafer scan sensor automatically detects the wafer storage condition. The robot arm with three-axis control
transfers the wafer to the UV irradiation unit.
B UV irradiation
The wafer is uniformly irradiated with UV rays in the chamber, and then the alignment conveyor transfers the
wafer to the alignment unit.
C Wafer alignment
The wafer is aligned with reference to the V-notch, and then the transfer arm sets the wafer on the tape peeling
table.
D BG tape peeling
The peeling tape is heatsealed to the BG tape at a point less than 3mm from the wafer edge and the BG tape is
peeled from the wafer at an angle of 180.
E Wafer unloading
The robot arm places the peeled BG tape and peeling tape into the dust box, and unloads the wafer in the cassette.
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- Fully automatic BG tape remover for 200mm wafers
- Applies the 180 degrees tape peeling technique to peel BG tape from the
wafer, minimizing stress on the wafer.
- It is possible to process large diameter, thin wafers, using UV curable
BG tape (E-series).
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- Compact, high performance unit
Suitable for small-lot production in the assembly process, and can also be used for research and development.
The compact design of the machine helps space saving; yet it can handle 300mm wafers.
- Easy-to-operate semi-automatic machine
Once the wafer is set on the peeling table, the peeling tape can be applied and the BG tape can be peeled
automatically in one simple input operation.
- Stable BG tape peeling
The peeling tape is heatsealed to the BG tape at a point less than 3mm from the wafer edge and the BG tape
is peeled from the wafer at an angle of 180°. This minimizes the stress on the wafer so that this
machine can process large diameter, thin wafers.
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Obtained ISO9001
certificate
JQA-QM7787
Ina technology center |
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Ina technology center (in Saitama Pre.), where RAD-3000series are manufactured, is ISO9001 certified
for the quality management system. |
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