PRODUCTS
Products for dicing & die bonding
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The Adwill LE Tape is highly value-added, insulating-type tape that functions as dicing tape and bonding tape. Prevents adhesive bleeding or unevenness by transferring the adhesive transferred uniformly onto the backside of a chip at the pick-up process. Suitable especially for die bonding of thin stacked CSPs. Promotes product reliability and enables process simplification with its use in the process from dicing to bonding.
Registration of patent(No.1987034) -
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Item LE Tape Current Process Formulation of Bonding Uniform against Whole chip Dot Patterning Chip size Not Affects Affects Machine Adjustment Not necessary Required Bleeding No Possible
Obtained ISO14001
certificate
JQA-EM0505
Agatsuma
Obtained ISO9002
certificate
JQA-1277
Agatsuma
Agatsuma (in Gunma Pref.), where D-series and G-series tapes are manufactured, is ISO14001 certified
for the
environment management system and ISO9002 certified for the quality management system.