PRODUCTS


Products for dicing & die bonding

  • The Adwill LE Tape is highly value-added, insulating-type tape that functions as dicing tape and bonding tape. Prevents adhesive bleeding or unevenness by transferring the adhesive transferred uniformly onto the backside of a chip at the pick-up process. Suitable especially for die bonding of thin stacked CSPs. Promotes product reliability and enables process simplification with its use in the process from dicing to bonding.

    Registration of patent(No.1987034)
  • Item LE Tape Current Process
    Formulation of Bonding Uniform against Whole chip Dot Patterning
    Chip size Not Affects Affects
    Machine Adjustment Not necessary Required
    Bleeding No Possible

Obtained ISO14001
certificate
JQA-EM0505
Agatsuma

Obtained ISO9002
certificate
JQA-1277
Agatsuma


Agatsuma (in Gunma Pref.), where D-series and G-series tapes are manufactured, is ISO14001 certified for the
environment management system and ISO9002 certified for the quality management system.