Products for dicing & die bonding

The Adwill LE Tape is highly value-added, insulating-type tape that functions as dicing tape and bonding tape. Prevents adhesive bleeding or unevenness by transferring the adhesive transferred uniformly onto the backside of a chip at the pick-up process. Suitable especially for die bonding of thin stacked CSPs. Promotes product reliability and enables process simplification with its use in the process from dicing to bonding.

Registration of patent(No.1987034)