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The "DBG (Dicing Before Grinding) process" is the process of manufacture that the wafer can be processed up to the thickness of 30 microns. This process has been named from the reverse order of the conventional semiconductor manufacturing processes. The conventional processes are to grind the backside of a wafer thinly, and then dice the wafer. These include a problem of handling or dicing the wafer, because it is fragile. To solve such a problem at low-cost, "DBG process" is the best manufacturing technology for a thin chip.




[Features]
This process will improve the yield of the production with easy handling (because of not handling a thin and fragile wafer). Chips are free from chipping or cracking. Therefore, the deflective strength of the chips will improve (it's higher than a chip made thin by other methods like a wet etching process). A capital investment and a running cost can be greatly reduced due to not using the wet etching process.

[Applicable products]
DBG Wafer Mounter: LTD-2500F/8
This machine can perform a series of operations: UV irradiation on the BG tape, wafer alignment (position adjustment), pick-up tape mounting, BG tape peeling, and workpiece storage in the cassette. In the wafer transportation, a porous table prevents wafer chipping.

[DBG Inline System]
The system has integrated the LTD-2500F/8 DBG Wafer Mounter and DBG grinder made of DISCO. This can perform the batch process: wafer back grinding, pick-up tape mounting, BG tape peeling, and workpiece storage in the cassette. As a result, an operator's handling risk of a wafer is reduced

DBG Inline System

[Specifications]

Unit size DBG Inline System 3540(W) x 2600(D) x 1800(H)mm LTD-2500F/8 1600(W) x 2300(D) x 1500(H)mm Applicable wafer size 200mm(8 inch),150mm(6 inch),125mm(5 inch)

* Consult us for special equipment.
* The specifications and physical dimensions of the DBG Inline System are subject to change without prior notice.

BG tape for DBG
You can use this tape for the wafer with a bump (connected electrode in protruding shape) and also for the back grinding of super-thin wafers. In addition, this tape prevents water penetration of grinding, and does not generate chipping and cracking on wafers.

Pick-up tape
Chips can be surely transferred from the BG tape, and even super-thin chips can be picked up.

[Other related products]
BG Tape Laminator: RAD-3500F/8

BG tape is used in the DBG process, and laminating the tape without putting pressure is critical (this will greatly influence the subsequent process). If you give a pressure to the tape when you apply it to a wafer, the wafer may be warped during grinding due to contraction of the tape or tension applied to the tape may cause chips to interfere in DBG process. We recommend "RAD-3500F/8" to solve these problems. This model has been used in the conventional back grinding process, employing the TTC (Tape Tension Control) format, one of the notable features of the model. The TTC also accomplishes the key role in the DBG process.