What is the DBG (Dicing Before Grinding) process?
This is a die fabrication process in which, after the circuit surface has been half-cut, the wafer is made ultra-thin through back grinding while the die is diced. With an in-line system comprised of the Lintec's Fully-Automatic Multifunction Wafer Mounter (RAD-2510F/12Sa) and Disco Corporation's grinder, the risk of damage to wafers is reduced and ultra-thin dies (25µm or less) can be produced with stability.
BG Tape for DBG Process
This is a back grinding tape that fully prevents infiltration of grinding fluid during polishing, as well as the generation of dies or cracks. The tape is laminated by the "RAD-3500 series," BG Tape Laminator.
Grinding Stress Model for BG Tape
Pick-up Tape for DBG Process
A special-purpose pick-up tape for fully transferring chips, diced after back grinding, from surface protective tape to ring frame. The tape is mounted with the "RAD-2510 F/12Sa," Fully-Automatic Multifunction Wafer Mounter.
Area and thickness of die to which
pick-up tape is applied
Dicing Die Bonding Tape for DBG Process
When applying dicing die bonding tape to separated dies in the DBG (Dicing Before Grinding) process, a process to cut the adhesive layer between the dies is required. High quality adhesive layer cutting of "LD Tape" is achieved by using full cut laser dicing.