PRODUCTS

Dicing Tape

Two types of back grinding tape are available. The "E series" which can be removed without placing stress on the wafer by decreasing adhesion by UV irradiation, and the "P series" which is non-UV type. In addition, there is the "S series" peeling tape.

Product Information

Si Wafer
Base Material:PVC-PO

  • High Expandability
  • Antistatic
  • Anti-chipping
  • High Adhesion
  • Easy Pick Up

Glass / Ceramics
Base Material:PVC-PET

  • Standard

Package Substrate
Base Material:PO

  • Standard
  • Antistatic

Stealth Dicing
Base Material:PVC-PO

  • Standard

Wafer with LC Tape
Base Material:PO

  • Standard

Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process. The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.

  1. Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small dies.
  2. Supports instant control of adhesion by UV irradiation, allowing large dies to be picked up easily.
  3. Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on ICs.
  4. Prevents contact damage of dies with superb expandability, which is not reduced by UV irradiation.
  5. Offers a variety of tape grades ranging from a tape with reduced tape chips at high speed, full-cut dicing to a special tape for thin wafers.
  6. Provides special grades not only for wafer dicing but also for package, ceramic or glass dicing.
  7. Provides various not only for blade dicing but also for laser dicing.
  8. Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standards.

Product Information

Si Wafer
Base Material:PVC-PO

  • For Small Die
  • Excellent Visibility and Evenness
  • For large Die, Easy Pick Up
  • Antistatic

The Adwill G series is a line of removable dicing tapes. With this type of tape, adhesive strength remains stable after wafer mounting. Using a film with superb flexibility and expansion characteristics, the tape also has outstanding expandability. It can be used with chips of multiple sizes, and is outstanding in terms of cost performance. Moreover, it can be used in an adhesive coating process environment that meets Class 100 (ANSI 209b) standards, and can be readily applied in fabrication processes.

D Series/ G Series Product Composition
Pre-cut Tape