Products for dicing & die bonding

The Adwill D-series tapes are revolutionary UV curable dicing tapes, changing their adhesive characteristics depending on operational process. Their initial strong adhesiveness secures wafers during dicing, and then is reduced by UV irradiation to facilitate pickup at die bonding. Perfect for wafer full-cut dicing to improve chip quality, and completely applicable to multiple sized chips.

1. Secure wafers with strong initial adhesiveness to ensure dicing, without any slipping or peeling even for small chips.

2. Support instant control of adhesive strength by UV irradiation to allow even large chips to be picked up easily.

3. Cause no contamination by metal ions or by adhesive residue on the wafer surface, and no detrimental UV irradiation effects on ICs.

4. Prevent damage of chips due to contacts with superb expandability, which is not reduced by UV irradiation.

5. Provide a variety of tape grades ranging from a tape with reduced tape chips at high-speed full-cut dicing to a special tape for thin packages.

6. Support the adhesive processing environment that meets Class 100 (ANSI 209b) standards.

The Adwill G-Series is removable dicing tape with long-term stability. Adhesive strength remains stable after wafer mounting and heat application. This tape has superior expandability using a film with superb flexibility and expansion characteristics. It is applicable to multi-sized chips and offers high cost performance. It can be used in the adhesive processing environment that meets Class 100 (ANSI 209b) standards.