Products for dicing & die bonding

1. Compact, high-throughput machine
   Applicable to both 12- and 8-inchi wafers. More compact with an integrated cassette loader and unloader. Provides high throughput with two processing lines.
2. High quality and high performance
   This sophisticated system is developed by Lintec, the industry-leading manufacturer of UV curable dicing tapes. Supports the optimization of illuminance and light quantity with high-output UV lamp and the light intensity checking per wafer processing job, and performs UV irradiation in the environment that prevents the inhibition by oxygen*.
   * Carries out UV irradiation in a chamber filled with nitrogen to exclude oxygen that inhibits UV cure.
3. Smooth and safe operations
   Improves operability with a large touch panel. Ensures safety for operations and maintenance, complying with the SEMI safety guidelines, from design to assembly stages.
   •Supports CE marking
4. Factory automation of assembly process
   Helps factory automation of total assembly process with incorporated host communication function and inline system.

OPTIONIONAL

• Host communication
  (Communications: compliant with SECSI and HSMS, software: compliant with GEM)
• Barcode system
• Visual inspection support system
• Double loader/unloader

A Workpiece loading and checking
A workpiece is automatically detected in the cassette, and then passed to the alignment unit.

B Irradiation preparation
The workpiece is aligned, placed onto the lower pass line of the transfer arm, and then transferred to the UV irradiation starting position. The chamber is filled with nitrogen at this time.

C UV irradiation
The workpiece in the chamber is moved above the UV lamp to be uniformly irradiated.

D Unloading preparation
The UV-irradiated workpiece is placed onto the upper pass line of the transfer arm and the chamber, and then waits for being unloaded in the upper position of the alignment unit.

E Work unloading
The processed work is unloaded into the cassette after the next work is sent to the chamber.

1. Improved process speed
   The fully automatic system with integrated cassette loader and unloader increases operational efficiency.
2. Controllable illuminance/ light quantity
   It is possible to control illuminance/ light quantity for effective UV irradiation with high-output UV lamp.
3. Uniform irradiation on entire surface
   The irradiation approach with traveling in X direction achieves uniform irradiation on the entire surface.
4. Self-diagnosis function helping quality control
   This sophisticated system incorporates the self-diagnosis function that accurately detects irradiation errors.

1. Highly accurate lighting with constant illuminance
   Square wave lighting by the high-frequency inverter offers highly accurate and steady UV irradiation with optimized illuminance and light quantity.
2. Automated feedback illuminance control
   The built-in sensor enables feedback control to keep constant UV lighting output. This contributes to fabrication of a constant quantity of semiconductors by maintaining steadiness of lighting through the whole lamp life.
3. Easy operation with just a button push
   Improves operability and stability with center loading and enhances operational efficiency.
4. Quick and uniform irradiation on entire surface
   The nitrogen-filled chamber travels to perform the accurate, uniform UV irradiation on the entire surface of the workpiece. Allows complete control of irradiation speed, depending on the size or type of wafers.

This simple machine is suitable for small-lot production in the assembly process and development purposes. Provides easy operation that only requires the user to place a wafer in the chamber and push the start button. The UV lamp located below the nitrogen-filled chamber travels for irradiating the workpiece uniformly.

Obtained ISO9001
certificate
JQA-QM7787
Ina technology center

Ina technology center (in Saitama Pre.), where RAD-2500series are manufactured, is ISO9001 certified for the quality management system.