• High Quality and High Performance
  This machine is a highly functional machine, able to process wafers of a large size such as 300mm and thin wafers. Features inline UV irradiation and tape release processing of BG tapes, and the wafer transfer system with suction of the entire wafer surface using a porous table, which is unaffected by wafer thickness or bending. Supports DGB (Dicing Before Grinding) multiprocessing.
• Excellent Cost Performance
  Precut tape wafer mounting offers excellent cost performance, eliminating wasted spaces between cut tapes. Without tape cutting process, this machine achieves a clean work environment, no frame damage, and a stable ring frame contact.
• Cutting-edge wafer mounting system
  This has adopted the TTC method that controls the tape attachment tension using a microprocessor to prevent air insertion, and provide the appropriate tape tension for dicing tape and subsequent processing.
• Comfortable operation and safety
  A large touch panel improves operability. Safe operation and maintenance have been provided at the design and assembly stages in accordance with the SEMI safety guidelines.
  _Conforms to SEMI S2-93A (Safety) and SEMI S-8 (Ergonomics)
  _Conforms to CE marking
• Assembly FA
  You can establish a wafer mapping system, etc. by integrating barcode & vision systems. Moreover, the total FA is achieved by using host communication (SECS, HSMS compliance) functions.

Optionional

• Vision System
• Barcode reader
• Bouble cassette
• Wafer box loader
• Secound UV unit
• DBG process
• Other inline devices

• Industry's first pre-cut tape handling machine
  The RAD-2500F/8 is designed to conserve resources and improve productivity, uses a revolutionary pre-cut tape method developed by Lintec.
• Reliability proven by business achievement
  The RAD-2500F/8 has been distributed worldwide. Customer confidence and repeat orders prove its superiority.
• High speed operation
  Throughput is 100 wafers per hour. While maintaining product quality, it guarantees speedy and accurate operation.

• Semi automatic mounting system for precut tape
  Provides easy operation using precut tapes. Applies dicing tapes automatically after the user sets the wafer and frame.
• Safety ensured for manual process
  Ensures safety using no cutter. Improves operational efficiency without tape cutting process.
• TTC System for accurate tape application
  The TTC system enables tape application with tape tension control, prevents air intrusion, and provides tape tension best for subsequent process.
• Cracked wafers mounting fully supported
  The optional feature to mount cracked wafers is available to reduce wafer waste effectively.
• Space saving and high performance
  High performance and yet compact. Helps space saving and increases efficiency of operation.

Optionional

• Static eliminator
• Top cover
• Cracked wafer mounting feature
• Wafer positioning pins