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Inquiry for Die bonding tape

Thank you for visiting our web site. We have provided you the following check sheet for choosing the suitable Die bonding tape. Please fill out the sheet as much as possible. If you have any questions or comments, please feel free to contact us at 1-480-966-0784.

A. Please fill out the information about your current or planned wafer.

Material	Si GaAs Others
Size	4" 5" 6" 8" 12"
Thickness	m
Backside condition	Flat Rough
Type	V-notch Orientation Flat
Device type

B. Please fill out the information about your current or planned die mounting condition.

Mounting method	Chip mount on chip Chip mount on lead frame Both *When you use both methods, please fill out the remaining fields in this section.
Mount on substrate (BGA/CSP substrate etc.)
Materials of board	BT-resin PI-tape Alloy 42 Others
Surface condition of island	Flat Rough How high is rough m
Solder resist	Yes No Company Name Model
Mount on Chip
Chip size	1st mm xmm 2nd mm xmm

C. Please fill out the information about your current or planned die bonding matelial.

Bonding type	Paste    Sheet
Company name
Model
Current problem

D. Please fill out the information about your current wafer mounting system.

Type	Manual Full-Automatic
Company name
Model

E. Please fill out the information about your current UV irradiation system.

Type	Manual Full-Automatic
Company name
Model

Any comments:

Please fill out following questions. (Please fill out all items.)

Name
Company name
Section
Address
Phone #
FAX #
E-Mail

Thank you for your cooperation. Our sales representatives will contact with you later.