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Inquiry for Die bonding tape

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  • Thank you for visiting our web site. We have provided you the following check sheet for choosing the suitable Die bonding tape. Please fill out the sheet as much as possible. If you have any questions or comments, please feel free to contact us at 1-480-966-0784

    A. Please fill out the information about your current or planned wafer.

    Material
    Si GaAs Others
    Size
    4" 5" 6" 8" 12"
    Thickness
       m
    Back Side condition
    Flat Rough
    Type
    V-notch Orientation Flat
    Device type

    B. Please fill out the information about your current or planned die mounting condition.

    Mounting method
    Chip mount on chip Chip mount on lead frame Both

    *When you use both methods, please fill out the remaining fields in this section.
    Mount on substrate (BGA/CSP substrate etc.)
    Materials of board
    BT-resin PI-tape Alloy 42 Others
    Surface condition of island
    Flat Rough
    How high is rough m
    Solder resist
    Yes No
    Company Name
                    Model
    Mount on Chip
    Chip size
     1st mm xmm
    2nd mm xmm

    C. Please fill out the information about your current or planned die bonding matelial.

    Bonding type
    Paste    Sheet
    Company name
    Model
    Current problem

    D. Please fill out the information about your current wafer mounting system.

    Type
    Manual Full-Automatic
    Company name
    Model

    E. Please fill out the information about your current UV irradiation system.

    Type
    Manual Full-Automatic
    Company name
    Model
     
         Any comments:

    Please fill out following questions. (Please fill out all items.)

    Name
    Company name
    Section
    Address
    Phone #
    FAX #
    E-Mail
    Thank you for your cooperation. Our sales representatives will contact with you later.
     
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