PRODUCTS

LC Tape Laminator

LC Tape Backside Coating Process (Video Clips)

Catalogue (PDF) Download

RAD-3600F/12 (PDF:134KB)

LC Tape Laminator
An optimal system has been realized based on the concept of maximizing the property of the backside coating tape (LC Tape) used in flip chip packaging.
High-precision tape lamination attained
By applying Lintec's unique lamination mechanism, high-precision tape lamination that prevents the formation of voids has been achieved.
Internal tape pre-cutting mechanism
The internal tape pre-cutting mechanism cuts the tape to wafer size prior to lamination, preventing potential wafer edge damage caused by the cutter after lamination.

Options

Host Communication Function
(Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
Double Cassette Loading
Wafer ID Reader

Suitable Tapes

LC Tape (Backside Coating Tape)

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ISO 9001 : 2008
Certificate JP08/060975
Lintec Corporation
Agatsuma Plant
Technology Administration
R&D Div. Research Laboratory
Planning Dept.
Business Administration Div.
Advanced Materials Operations.

ISO 9001 : 2008
Certificate JQA-QM7787
Lintec Corporation
Ina Technology Center

ISO 14001 : 2004
Certificate JP08/070484
Lintec Corporation
(Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others)

At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.