Pressurized Curing System
RAD-9100-450
- Void elimination after die bonding.
The heat curing process under high-pressure environment, helps eliminate fine air voids created after die bonding on uneven areas of substrates. Best suited for use with Lintec's dicing die bonding tape (LE Tape).
- Ability to set heating and pressurizing options.
Operators are able to set desired heating temperatures and pressure levels to meet the required curing condition for each tape and substrate. Usable for precise control in each respective stage (step curing method).
- Convenient touch-panel data entry.
Parameters are easily set by using a touch panel to select recipe for each product.
- Two types available.
Product line-up includes equipments capable of handling small volume production such as in for research labs:RAD-9100-050, as well as large volume production:RAD-9100-450.
- No need for substrate baking process.
Introduction of this process eliminates the need for substrate baking process prior to die bonding.
ISO 9001 : 2008
Certificate JP08/060975
Lintec Corporation
Agatsuma Plant
Technology Administration
R&D Div. Research Laboratory
Planning Dept.
Business Administration Div.
Advanced Materials Operations.
ISO 9001 : 2008
Certificate JQA-QM7787
Lintec Corporation
Ina Technology Center
ISO 14001 : 2004
Certificate JP08/070484
Lintec Corporation
(Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others)
At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.
