PRODUCTS
Products for Dicing & Die Bonding process
Our products contribute to improve the productivity and save labor in dicing process of semiconductor production. We have provided the following products: Wafer Mounting System that automatically mounts a wafer to the ring frame and secures it with the dicing tape, UV Irradiation System that irradiates the wafer with UV rays after dicing to weaken the adhesive strength of the dicing tape so that chips can be picked up easily, Barcode and Vision System that controls a wafer processing using barcodes.
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Dicing Tape
There are two types of tapes that are the "D-series", UV curable tape and the "G-series", removable tape. The "D-series" tape makes the pick-up easy for the die bonding because the adhesive strength of the tape becomes weaker with UV irradiation. The "G-series" tape features excellent long-term stability
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Die Bonding Tape
This is a multi-function tape that has the function as the dicing tape and the transcript function of the adhesive to the backside of chips. This also solves the problem such as bleeding a liquid adhesive. Therefore, The tape enables to simplify the process control and to improve products reliability.
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Wafer Mounting System
This is an efficient wafer mounter with high throughputs and employs as innovative pre-cut tape format. There are five types of products that you can select depending on a wafer size with full automatic or semi automatic.
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UV Irradiation System
This produces efficient and uniform UV irradiation. There are four types of products that you can select depending on a wafer size with full automatic or semi automatic.
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Barcode Label for Clean Room
We have adopted the label substrate that does not generate dust easily. Therefore, this label is suitable for a clean room. We also have an excellent heatproof label material in heat resistance, solvent resistance, and abrasion resistance.
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Wafer Management System
The following products are indispensable for controlling wafer processing using barcodes, including barcodes used in clean rooms. Using these items with the "RAD-5000VS" enables a barcode to be created containing the wafer ID number and attaches the barcode label to the wafer. The system enables full automation of the assembly process.